Integrating electronics in Organ on Chip

Today TNO at Holst Centre announces the publication of a whitepaper about integrating electronics with organ-on-chip-related technologies. Integration can assist in the development of better medicines, such as those for neurodegenerative and cardiovascular diseases. Holst Centre looks to contribute its flexible electronics and manufacturing expertise to the ecosystem.

OoC with integrated electronics, and related products with similar functionality. Left. 3Brain's high-density multielectrode array single wells. Right. Multi-electrode array multiwell plate from Multichannel Systems. Centre. OoC prototype with integrated TEER sensors from the Wyss Institute at Harvard University.

Over the past decade, organ on chip (OoC) technology has become prominent in the world of drug development, with the first wave of OoCs already on the market. The second wave is expected to integrate electronics and sensors. With the integration of electronics, OoC-related technologies can assist in developing better medicines, such as those for neurodegenerative and cardiovascular diseases, with brain and heart on chip devices. Involvement of all stakeholders is essential to realize the full potential of OoC-related devices, to which TNO at Holst Centre looks to contribute its flexible electronics and manufacturing expertise.


Whitepaper

This paper will touch on the industry's viewpoint, regarding the integration of electronics within in vitro devices, as well as the progress TNO at Holst Centre has made in creating solutions in this application domain.

 

Authors of the whitepaper are:
Dustin D. Dopsa, Auke J. Kronemeijer and Gerwin Gelinck.

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